Advanced Packaging Wafer-Level Underfill & Flux Jetting Machine
Mobile Side Key SiP & Capacitor Encapsulation Dual-Valve Precision Dispenser
The GS600 series is a next-generation dual-valve dispensing platform engineered to handle sidewall button sealing and capacitor root encapsulation in advanced SiP (System in Package) production for smartphones and compact consumer electronics.
Equipped with dual-valve synchronous and asynchronous dispensing capability, the GS600 series allows manufacturers to apply different materials or layers in a controlled sequence. Its smart vision system auto-detects the side wall or capacitor position and adjusts the dispensing path in real time to achieve uniform glue lines without excess overflow. This ensures the adhesive properly surrounds the capacitor base without spreading beyond design tolerances.
Key Advantages
- Purpose-built for mobile side button sealing: Delivers tight, neat glue lines along phone side keys to protect against ingress.
- Precision capacitor encapsulation: Wraps adhesive cleanly around the capacitor root to reinforce connections while controlling glue spread.
- Dual-valve configuration: Supports simultaneous or sequential material dispensing, optimizing cycle time for multi-step potting.
- Smart process control: Machine vision, laser height detection, and glue weight monitoring prevent overflow and ensure stable repeatability.
- Compact footprint: Cabinet-style inline system easily integrates into high-volume smartphone and SiP production lines.
Key Applications
✓ Smartphone side button (side-wall) gluing and sealing
✓ Capacitor root encapsulation in SiP modules
✓ Edge sealing for micro-electronics
✓ Selective potting for compact components
✓ Micro-volume dam & fill in tight spaces
Technical Specifications
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Cleanliness Level
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Cleanliness of working area
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Class 100 (Class 1000 workshop );
Class 10 (Class 100 workshop)
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Jetting System
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Transmission System
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X/Y: Linear motor
Z: Servo motor&Screw module
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Repeatability (3sigma)
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X/Y:±3 μ m Z:±5 μ m
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Positioning Accuracy (3sigma)
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X/Y:±10 μ m
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Max. Speed
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X/Y:1000mm/s Z: 500mm/s
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Max. Acceleration
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X/Y:1g Z: 0.5g
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Visual System
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Pixel
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130W
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Identify Accuracy
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±1pixel
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Identify Range
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10*12mm
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Light Resource
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Red, Green, White combined light + extra red illumination
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Weighing Calibration System
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Weighing Accuracy
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0.01mg
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Chuck Table
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Vacuum Suction Planeness Deviation
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≤30μ m
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Heating Temperature Deviation
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±1.5℃
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Lifting height repeatability
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±10μ m
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Vacuum Suction Pressure
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-85~-70KPa (Settable)
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General Condition
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Footprint W× D × H
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3075*2200*2200mm (Display screen unfold)
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Weight
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2900kg
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Power
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16.5KW
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Operation Environment Temperature
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23℃±3℃
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Operation Environment Humidity
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30-70%
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FAQ
Q1: How does the GS600DD manage glue overflow for tiny capacitors?
A: Its precision valve control, laser height detection, and machine vision auto-correction ensure the glue only covers the capacitor base as designed, minimizing excess spread.
Q2: Can I use different adhesives for side buttons and capacitors?
A: Yes. With dual-valve operation, you can run different adhesive types or viscosities either simultaneously or in sequence for multi-step encapsulation.
Q3: What type of valves are compatible?
A: The GS600 series supports screw valves for thicker materials and piezo jetting valves for micro-volume, low-viscosity adhesives.
Q4: How does it handle continuous production?
A: The system includes glue tank monitoring, low-level alarms, real-time vision tracking, and stable cabinet design for 24/7 operation in modern mobile device lines.
About Mingseal
Mingseal specializes in high-end precision dispensing solutions for semiconductor, SiP, MEMS, smartphone, and other consumer electronics industries. With rich industry expertise and robust R&D, Mingseal helps global manufacturers solve critical challenges in micro-assembly, potting, and advanced packaging — delivering reliable performance and yield improvement for every production line.
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2.1M SiP Advanced Packaging Wafer Level Underfill Machine Flux Jetting Machine Images
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